深圳市合丰光电有限公司

           Shenzhen Hufond Optoelectronics CO.,Ltd

                  LED Light Source Operation Manual

Dear Customers,

We sincerely appreciate your long-term trust and support for Hufond Optoelectronics. This manual focuses on operating precautions for our LED products to deliver customized guidance for proper application. To ensure safe, rational and efficient use of our LED products and minimize quality failures and associated costs, please thoroughly read this manual prior to use, and circulate and communicate its contents to all relevant departments including production, quality control and engineering.

I. Storage, Shipping & Handling Requirements for LED Products

1.For fully packaged LED products, we recommend storage in an environment with temperature between 5°C and 30°C and relative humidity below 60%. The surrounding area must be free of sulfur-containing, acidic, alkaline and other corrosive gases.

2.During storage and transportation, avoid multi-layer stacking, impact and dropping that may cause damage. Do not apply external pressure to the luminous areas of lens-style high-power LEDs and integrated COB light sources, as this will lead to crushing damage.

3.All unpacked LED light sources shall be fully installed within 168 hours. For unused products, perform dehumidification treatment before hermetic sealing.

-Dehumidification parameters for single high-power LEDs: 80°C ±5°C for 8 hours

      -Dehumidification parameters for COB integrated light sources: 120°C ±5°C for Hermetically sealed products remain usable for up to six months.

II. Soldering & Operation Specifications for LED Products

1. Single High-Power Light Sources

1.1 Single high-power LEDs are available in two lens versions: high-temperature resistant PC lens and soft silicone molded lens.

1.2 Soldering Requirements

Manual soldering: Use a soldering iron with power less than 20W, temperature below 350°C, single soldering duration within 3–5 seconds, and avoid repeated soldering.

High-temperature PC lens LEDs: Reflow soldering is recommended; peak temperature shall not exceed 200°C.

Soft silicone molded lens LEDs: Theoretically withstand up to 250°C; peak reflow temperature is controlled within 240°C in practical use.

Do not bend the PCB after soldering LEDs. Clean PCBs manually with alcohol or board cleaning solvent (alcohol is preferred).

 1.3 Reflow Profile for High-Temperature PC Lens LEDs with Low-Temperature Solder Paste

1.4 For soft silicone (top mold) lens LEDs using low-temperature solder paste, the same reflow soldering curve as high-temperature PC lens LEDs can be employed. Since soft silicone lenses exhibit higher temperature resistance than high-temperature PC lenses, medium-temperature solder paste is suitable. When using medium-temperature solder paste for surface mount reflow soldering, the recommended reflow curve is as follows:

 1.5 Thermal ControlTo meet service life requirements, ensure the temperature of support copper posts and pins stays below 75°C for effective heat dissipation.To reduce thermal resistance during assembly: Apply solder paste or thermal compound evenly over a reasonable coverage area; insufficient or uneven coating is prohibited. All thermal interface materials shall pass a minimum 500V dielectric withstand voltage test.

1.6 Driver SpecificationsThis product must be driven by a constant-current power supply with output current matching the power range specified in the datasheet. If constant-voltage power supplies or other operating conditions are adopted, conduct a full risk assessment of performance and reliability.

2. Integrated COB High-Power Light Sources

2.1 Soldering RequirementsReflow soldering is prohibited for COB products. For manual soldering, set the iron temperature to 350°C with single soldering time under 5 seconds; avoid repeated soldering.Do not squeeze the luminous area during operation to prevent crushing or permanent damage. Keep the surface free of chemical residues and contaminants to avoid thermal chemical reactions. Peel off the plastic protective film/cap only after soldering is complete.

2.2 Thermal ControlFor reliable heat dissipation: Control the temperature of the TS negative pad below 85°C; the surface temperature of COB colloid shall not exceed 200°C.To lower thermal resistance: Spread thermal compound evenly over a sufficient area without uneven or insufficient coating. If thermal pads are used, fasten screws tightly to ensure full contact between the substrate and thermal pad with no gaps. All thermal interface materials shall pass a minimum 500V dielectric withstand voltage test.

2.3 Driver SpecificationsThis product must be driven by a constant-current power supply with output current matching the power range specified in the datasheet. If constant-voltage power supplies or other operating conditions are adopted, conduct a full risk assessment of performance and reliability.

III. General Operating Prohibitions

The product shall not be operated under the following conditions. If unavoidable, comprehensive performance and risk evaluation is mandatory:3.1 No effective ESD protection measures implemented; production equipment and testing instruments lack proper grounding.3.2 Direct or indirect exposure to moisture or water (e.g., rain splashing).3.3 Exposure to corrosive gases including Cl₂, H₂S, NH₃, SOₓ, NOₓ, etc.3.4 Exposure to dust, liquid splashes or oil contamination.

 IV. Diagrams for Correct Product Handling

Company Address: Building 2, HuaFeng ZhenBao LED Industrial Park, Beihuan Road, Shiyan Street, Bao‘an District, Shenzhen City, Guangdong Province, China Tel:+86 17724716631 E-mail:Iris.sale@outlook.com